Blue Anodized BGA Heatsink

Product Features Width [mm] 58 Height [mm] 18 Length [mm] 58 Material Aluminum 6063-T5 Surface Blue Anodized Weight [g] 23 Description: Aluminum extrusions BGA heat sinks for electronic device and the PCB Heat sinks are designed for common package sizes like T0220, T0247, and D2pak Aluminum extruded 6063-T5 Cooler and high aspect ratio aluminum heatsink extrusion Stamped heat sink can have features that clip on to the device so that a screw or secondary clip is not required Aluminum stampings are anodized for improved performance in natural convection BGA heat sinks are usually crosscut to convert the extruded fins into pins which allow them to be used in more diverse applications The heat sinks can be either attached to the device or to the PCB depending upon the application and the mechanical requirements Board Level heat sinks are so named because they are generally attached both to the device and the PCB Pushpins are another common attachment method and require two small holes in the PCB The push pin can be made from plastic or metal, uses the energy of a small spring to provide enough force to keep the heat sink in place.