Polyamide Bonds
Polyamide Bonds
Better machine tool availability and lowering of costs through higher productivity demanded much higher performance from diamond/CBN grinding wheels. This resulted in development of polyamide bonds. Polyamide resin is more tough and degenerates at approx. 300 degrees F higher as compared with normal phenolic resins. It also has unique resilience resulting in grinding with lower force. Hence polyamide bond offers much higher durability, higher material removal rates and better surface finish in demanding applications compared with phenolic resin bond.
